dbl0.3j~dbl0.3m surface mount diode features low profile space ideal for automated placement glass passivated chip junctions low leakage current high forward surge capability high temperature soldering 260 /10 seconds at terminals component in accordance to rohs 2002/95/1 and weee 2002/96/ec mechanical date case: jedec sod-123fl molded plastic body over glass passivated chip terminals: solder plated, solderable per j-std-002b and jesd22-b102d polarity: laser band denotes cathode end wei g ht: 0.017 g ram g g maximum ratings & thermal characteristics (t a = 25 c unless otherwise noted) note 1: mounted on p.c.b. with 0.036 x 0.06? (0.9 x 1.5mm) copper pad areas. electrical characteristics (t a = 25 c unless otherwise noted) note2: pulse test:300 s pulse width,1% duty cycle. 2 a t a =100 50 reverse current v r =v dc t a =25 i r -- unit instantaneous forward voltage i f =0.3a (2) v f - 0.95 1.10 v items test conditions symbol min type max thermal resistance from junction to ambient (1) t j , t stg ?55 to +150 maximum repetitive peak reverse voltage maximum rms voltage maximum dc blocking voltage maximum average forward rectified current operating junction and st orage temperature range peak forward surge current 8.3 ms single half sine-wave superimposed on rated load 600 420 600 dbl0.3k 800 v rms v dc v rrm 560 800 dbl0.3m 1000 700 1000 v v / w r ja a 15 v a 0.3 220 i f ( av) i fsm unit symbol items dbl0.3j http://www.luguang.cn email:lge@luguang.cn 1.0 0.2 2.8 0.1 1.9 0.1 cathode band top view 3.7 0.2 0.6 0.25 1.4 0.15 0.10-0.30 sod-123fl dimensions in millimeters
dbl0.3j~dbl0.3m surface mount diode characteristic curves (t a =25 unless otherwise noted) http://www.luguang.cn email:lge@luguang.cn
|
